Pressure bulkhead structure with integrated selective electronic switch circuitry, pressure-isolating enclosure containing such selective electronic switch circuitry, and methods of making such

ABSTRACT

Pressure-isolating bulkhead structures with integrated selective electronic switches circuitry are provided. The pressure-isolating bulkhead structure may be a single unit having the integrated electronic switch circuitry, as well as an electrical connector that includes at least one of a wire and a pin contact. Such integrated selective electronic switch circuitry may be fashioned within a self-contained, inner pressure-isolating enclosure body. Such inner pressure-isolating enclosure body may be produced about the selective electronic switch circuitry such that the inner pressure-isolating enclosure body and switch circuitry are produced as a unit, which can be easily placed within a variety of bulkhead structures, and subsequently within a perforating gun.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Application No.62/553,483 filed Sep. 1, 2017, U.S. Provisional Application No.62/515,178 filed Jun. 5, 2017, U.S. Provisional Application No.62/505,365 filed May 12, 2017, and U.S. Provisional Application No.62/486,903 filed Apr. 18, 2017, each of which is incorporated herein byreference in its entirety.

FIELD

The present disclosure relates generally to pressure bulkhead structuresfor use in perforating guns and perforating gun select fire subassemblies/systems, the types of which are used for perforatingwellbores of oil and natural gas wells. More specifically, the presentdisclosure relates to pressure isolating bulkhead structures forcontaining an electronic component, as well as individual structuralcomponents of such bulkheads.

BACKGROUND

Perforating guns are commonly used to convey and detonate explosivesubstances (shaped charges) within wellbores, with the ultimateobjective of achieving a hydraulic connection with sought-after depositsof oil and/or natural gas within and/or adjacent to permeable reservoirrocks. Once a promising drilling location has been identified, thecreation of wells typically begins with the boring of a hole (i.e.borehole) to reach sought-after deposits of oil and/or natural gas. Toprevent collapse of the borehole, a cylindrical casing may be insertedinto the borehole. In many situations, cement is pumped into a more orless annular space between the cylindrical casing and the largercylindrical hole wall to mechanically stabilize the well. While thismethod improves the stability of the wellbore, it also isolates theinner portions of the casing and the wellbore from the sought-afterdeposits of oil and/or natural gas.

A perforating gun employs a detonator/initiator and explosivecomponents, which are typically lowered into the casing of the boreholevia a wireline or tubing. Operators of the perforating gun at thesurface of the wellbore may convey and/or retrieve the gun, or morespecifically a series of perforating gun modules. The perforating gunsmay be conveyed to desired depths within a wellbore in order to detonateexplosives to create perforations in the casing, the surrounding cementwalls of the wellbore, and the surrounding geological formations. Suchperforating gun systems may be used in vertical, deviated, or horizontalborehole shafts. Such perforating gun designs often include structuresto protect internal operational components of the gun from thepotentially damaging temperatures, vibrations, shock impact, pressures,and fluid-containing environments found within a wellbore, until theactual detonation of explosives occurs. In traditional selectivelyinitiated perforating gun assemblies/systems, the devices includehousings, also known as select fire subs, which include pressurebulkheads, which enclose/isolate components such as the pin assemblies,separate detonators, and shaped explosive charges. Examples ofperforating guns, their components, and systems which employ such gunsare described in U.S. Pat. No. 9,494,021 to Parks et al., U.S. Pat. No.9,145,764 to Burton et al., and U.S. Pat. No. 9,080,433 to Lanclos etal., each of which are incorporated by reference in their entireties.For the purposes of this application, a perforating gun select fire subassembly is considered a component of the larger “perforating gun”apparatus. The perforating gun select fire sub assembly often includesthe pressure bulkhead structure for housing a firing pin assembly, andother internal components, such as pass-through wiring.

As noted, perforating gun system designs frequently utilizepressure-isolating housing components or bulkhead structures withintheir select fire sub assemblies for isolating/protecting individual gunmodules/components from one another along a chain of gun modules. Suchpressure-isolating structures help to prevent inadvertent detonation ordetonation interference as a result of exposure to wellbore fluid,pressure, or other conditions of the surrounding wellbore environment.Such pressure-isolating bulkheads may house simple-electricalfeed-through or mechanical switches, which enable detonation of the nextgun in a line of sequential gun modules.

Use of simple electrical or mechanical switches may mean that only onegun module is electrically connected at any one time to the controllerat the wellbore surface, and a specific sequence of events must occur inorder to initiate each gun module in a sequence of gun modules.Specifically, the gun modules of these systems are typically detonatedfrom the lowest-most gun module (or end-most gun module farthest fromthe controller at the surface) to the highest gun module (closest to thecontroller). An interruption in the firing sequence of sequential gunmodules (whether by failure of the simple electrical or mechanicalswitch) means that an entire firing operation would need to be aborted,adding much cost and time delay to a completion operation. Further, thefact that only one gun module is electrically connected at any one timemeans that the entire gun string cannot be pre-tested and/or verified tobe functional and correctly assembled. Gun failure can only be foundwhen it is too late in the completion operation and the gun operator maynot be fully confident that the entire system will eventually work asdesired.

In order to provide more reliability and safety to perforating gunassemblies/systems, selective electronic switches have been developedfor placement within various components of perforating structures, suchas those offered by DynaEnergetics GmbH & Co. KG under the brandDYNASELECT® system, which incorporates a selective electronic switchwithin a detonator. Such selective electronic switches may include theDYNAENERGETICS® Selectronic Switch. While effective in providingdetonation reliability and higher safety levels (i.e. avoidinginadvertent detonation from stray voltage fluctuations or intense RFfrequencies which may be common around wellbore operations) suchcomponents may add material cost for the operators of such systems whencompared to simpler diode type switch systems. Even more advances havebeen set out in commonly assigned U.S. patent application Ser. No.15/499,439, entitled “Electronic Ignition Circuit and Method for Use,”filed Apr. 27, 2017, which is incorporated by reference in its entirety.

Others have disclosed arrangements for employing electronic switches inretainer means, for retaining components of a perforating gun within thetubular gun structure. Such specific retainer devices, as thosedescribed in U.S. Pat. No. 9,291,040 to Hardesty et al., which isincorporated by reference in its entirety, require that distinctretainers (i.e. threaded pieces) be employed in a perforating gunassembly, thereby imparting potential equipment-specific limitations onoperators of such systems. Depending on particular design features, suchretainer devices may also expose contained circuitry to environmentalconditions of the surrounding wellbore (especially if they are notsufficiently electrically isolated or protected from the wellbore),thereby compromising the reliability or effectiveness of such switchesduring operation.

It should also be noted that the previously described pressure bulkheadstructures of select fire sub assemblies may contain void spaces withintheir structures. As a result, vibrations, shock-impact, or jarringmovement associated with the conveying (pump-down operation) orretrieving of the equipment, or from detonation of gun modules in closeproximity on a wireline, can cause components within the pressurebulkhead structures to shift about or contacts to be damaged,potentially leading to a misfire event or damage to the components thatmay be housed within such pressure bulkhead structures. Such damage mayoccur even if the components have some fixed connection at one end ofthe pressure bulkhead.

In view of the disadvantages associated with currently availableswitching devices for detonating perforating gun modules, there is aneed for selective electronic switching devices (and associated circuitboards) which may be easily employed within a long string of perforatinggun modules, where the switching devices provide protection fromvibrations and environmental conditions of the wellbore. There is afurther need for switching devices that may be easily placed within avariety of industry standard gun module equipment design formats,without requiring specific retention constructions.

BRIEF DESCRIPTION

This generally describes a pressure bulkhead structure of a perforatinggun select fire sub assembly. The pressure bulkhead structure includes apressure isolating structure having a pressure isolating enclosure body.The pressure isolating enclosure body includes a sealed first end, asealed second end, and an elongated body portion that extends betweenthe sealed first and second ends. According to an aspect, the pressurebulkhead structure includes a selective electronic switch circuitry thatis positioned between the sealed first end and the sealed second end.The selective electronic switch circuitry may be immovable/secured andsealed within the pressure-isolating enclosure body, so that it isisolated from surrounding environmental conditions, such as the wellboretemperature and fluid/moisture, electrical charge variations, andphysical shocks. An electrical connector, a wiring arrangement and acommon ground contact may extend from the selective electronic switchcircuitry. The electrical connector may be one of a wire and a pincontact. In an embodiment, the electrical connector extends from theselective electronic switch circuitry through the sealed first end,while the wiring arrangement and the common ground contact both extendfrom the selective electronic switch circuitry through the sealed secondend.

This disclosure further describes pressure-isolating structures for usewith a pressure bulkhead of a perforating gun select fire sub assembly.According to an aspect, the pressure-isolating enclosure includes aninner pressure-isolating enclosure for placement within a pressurebulkhead structure. As described hereinabove in relation with thepressure-isolating enclosure, the inner pressure-isolating enclosureincludes an inner pressure-isolating enclosure body having a sealedfirst end, a sealed second end, and an elongated body portion thatextends between the sealed first and second ends and is positionedbetween the inner pressure-isolating enclosure body. The innerpressure-isolating enclosure may include a selective electronic switchcircuitry positioned within the inner pressure-isolating enclosure bodyand adjacent an inner edge of the inner pressure-isolating body. Theselective electronic switch circuitry may be positioned inward from thesealed first and second ends of the inner pressure-isolating enclosurebody, such that the selective electronic switch circuitry is spacedapart from the sealed first and second ends. A pin contact may extendfrom the selective electronic switch circuitry through the sealed firstend, and a wiring arrangement may extend from the selective electronicswitch circuitry through the sealed second end. According to an aspect,a common ground contact extends from the selective electronic switchcircuitry through the sealed second end. The selective electronic switchcircuitry may be arranged within the inner pressure-isolating enclosureso that it is immovable and sealed within the inner pressure-isolatingenclosure body.

The disclosure further describes a pressure bulkhead structure forplacement in a select fire sub assembly of a perforating gun module. Thepressure bulkhead structure may enclose a down hole facing pin assembly,and form a pressure-isolating chamber between sequential perforating gunmodules. According to an aspect, the pressure bulkhead structureincludes an inner pressure-isolating enclosure substantially asdescribed hereinabove, and an outer pressure-isolating enclosureincluding a conductive material. The outer pressure-isolating enclosuremay include a first end and a second end, the first end surrounding apin assembly. According to an aspect, the outer pressure isolatingenclosure includes an outer wall edge, and an inner wall edge thatdefines an interior cavity. The pressure bulkhead structure may alsoinclude a selective electronic switch circuitry positioned within theinner pressure-isolating enclosure body, the selective electronic switchcircuitry. A pin contact may be attached to and extend from theselective electronic switch circuitry, while also partially extendingthrough the sealed first end to make electrical contact with the pinassembly located outside the inner pressure-isolating enclosure body.According to an aspect, the pressure bulkhead structure includes awiring arrangement and a common ground contact, both attached to andextending from the selective electronic switch circuitry, and partiallyextending through the sealed second end. The wiring arrangement provideselectrical communication connection between the selective electronicswitch circuitry and other components outside of the innerpressure-isolating enclosure body, and the common ground contact makeselectrical contact with the conductive material of the outer pressureisolating enclosure, either directly or indirectly.

The present disclosure further relates to pressure bulkhead structures,substantially as described hereinabove, for incorporation into a selectfire sub assembly of a perforating gun.

BRIEF DESCRIPTION OF THE FIGURES

A more particular description will be rendered by reference to specificembodiments thereof that are illustrated in the appended drawings.Understanding that these drawings depict only typical embodimentsthereof and are not therefore to be considered to be limiting of itsscope, exemplary embodiments will be described and explained withadditional specificity and detail through the use of the accompanyingdrawings in which:

FIG. 1A is a top, partial cross-sectional view of a pressure bulkheadstructure with an integrated selective electronic switch circuitry,according to an embodiment;

FIG. 1B a side, partial cross-sectional view of the pressure bulkheadstructure of FIG. 1A;

FIG. 2 is a perspective view of a pressure bulkhead structure for usewith an integrated selective electronic switch circuitry, according toan embodiment;

FIG. 3A is a bottom view of the pressure bulkhead structure of FIG. 2;

FIG. 3B is a side view of the pressure bulkhead structure of FIG. 2;

FIG. 4 is a partial, side cross-sectional view of a pressure bulkheadstructure for use in a perforating gun select fire sub assembly, withintegrated selective electronic switch circuitry contained within aninner pressure-isolating enclosure body, according to an embodiment;

FIG. 5 is a partially exploded and side perspective view of a pressurebulkhead structure, according to an embodiment;

FIG. 6 is a perspective view of an inner pressure-isolating enclosurefor use in a pressure bulkhead structure, according to an embodiment;

FIG. 7 is a top, partial cross-sectional view of a pressure bulkheadstructure with integrated selective electronic switch circuitry,according to an embodiment;

FIG. 7A is a side, partial cross-sectional view of a pressure bulkheadstructure with integrated selective electronic switch circuitry,according with an embodiment;

FIG. 7B is a side, partial cross-sectional view of an alternativepressure bulkhead structure with integrated selective electronic switchcircuitry, according to an embodiment;

FIG. 7C is a side, partial cross-sectional view of an alternativepressure bulkhead structure with integrated selective electronic switchcircuitry, according to an embodiment;

FIG. 8A is a side, partial cross-sectional view of an alternativepressure bulkhead structure with integrated selective electronic switchcircuitry, according to an embodiment;

FIG. 8B is a partial exploded, side cross-sectional view of the pressurebulkhead structure with integrated selective electronic switch circuitryof FIG. 8A;

FIG. 8C is a partial, side cross-sectional view of a splittable pressurebulkhead structure with integrated selective electronic switch circuitryaccording to an embodiment;

FIG. 8D is a partial exploded, side cross-sectional view of a splittablepressure bulkhead structure with integrated selective electronic switchcircuitry according to an embodiment;

FIG. 8E is a partial, side cross-sectional view of a capped pressurebulkhead structure with integrated selective electronic switch circuitryaccording to an embodiment;

FIG. 8F is a partially exploded, side cross-sectional view of a cappedpressure bulkhead structure with integrated selective electronic switchcircuitry according to an embodiment;

FIG. 9 is a partially exploded, side cross-sectional view of a pressurebulkhead structure with an integrated selective electronic switchcircuitry, both of which are illustrated as being contained within aperforating gun select fire sub assembly according to an embodiment; and

FIG. 10 is a side perspective view of a pressure isolated bulkheadstructure with an integrated selective electronic switch circuitry(state of the art electrical switch) (including an innerpressure-isolating enclosure (not shown)) according to an embodiment.

Various features, aspects, and advantages of the embodiments will becomemore apparent from the following detailed description, along with theaccompanying figures in which like numerals represent like componentsthroughout the figures and text. The various described features are notnecessarily drawn to scale, but are drawn to emphasize specific featuresrelevant to some embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to various embodiments. Eachexample is provided by way of explanation, and is not meant as alimitation and does not constitute a definition of all possibleembodiments.

The terms “pressure bulkhead” and “pressure bulkhead structure” shall beused interchangeably, and shall refer to an internal, perforating gunhousing compartment of a select fire sub assembly. In an embodiment, italso contains a pin assembly and allows the electrical passage of awiring arrangement. The bulkhead structures may include at least oneelectrically conductive material within its overall structure.

The term “pressure-isolating” shall refer to the capacity of astructural component to withstand influence of at least pressure fromall sides of a surrounding environment. The pressure-isolating capacitymay be imparted by one or more of a variety of design techniques. Forexample, the shape and/or construction of the structural componentitself (such as the housing shape, or housing manufacturing method) mayprotect components housed within a component from external environmentalpressure/as well as other deleterious environmental conditions. The useof additional features such as O-rings or other seals with the component(such as surrounding or immediately adjacent a housing) may also protectstructures housed therein from influence of external pressures.Alternatively, protection from outside pressures may be accomplishedthrough specific enclosure-manufacturing techniques which seal withinthe body of the housing/enclosure, solid state electronics, and whichalso provide seals around an extending pin or wire contact, wirearrangement, and ground contact feature which may extend from the solidstate electronics to locations outside the enclosure/housing.Alternatively, such protection from external pressures may be impartedby two or more design techniques, such as a combination of two or moreaspects selected from shape, manufacturing/construction techniques, anduse of secondary features (as with the use of one or more O-rings).

The term “integrated” shall refer to selective electronic switchcircuitry and/or a selective electronic switch circuit board that istightly enclosed, encased, or bonded to a surrounding enclosure,housing, or body, such that it is not easily separated from theimmediately surrounding enclosure, housing, or body, without at leastminimal destruction of the selective electronic switch circuitry orparts thereof. For example, an integrated selective electronic switchcircuitry (solid state electronics) would be one that is adhesivelyfastened to, press-fitted into, or otherwise immovably bonded orattached to an immediately surrounding enclosure, housing, or body, andwhich may easily be damaged upon attempted separation from theenclosure, housing, or surrounding body. The attachment makes the solidstate electronics immoveable or practically immoveable within theenclosure, housing, or surrounding body. For example, a surroundingenclosure, housing, or body may be directly injection molded about,extruded about, coated about, 3-D printed about, or otherwise closelysituated about the solid state electronics of a selective electronicswitch circuit board or one or more edges of the circuit board, suchthat removal of the surrounding enclosure, housing, or body would bedestructive to the selective electronic switch circuit board orstructures thereon. The methods of manufacture may also act to seal thesolid state electronics from exposure to harmful external environmentalfactors. The integrated selective electronic switch circuitry may bebonded to a surrounding housing, enclosure or body by being bonded onall surfaces to the surrounding housing, enclosure, or body, oralternatively, by being bonded along one or more of six sides/surfacesof a three-dimensional circuit board. The bonding of the integratedselective electronic switch circuitry may occur on either 1, 2, 3, 4, 5,or 6 sides/surfaces of a three dimensional circuit board (such as arectangular circuit board). The circuit board may be for example, atraditional circuit board including a planar board-like structure withcircuit components or micro-processor chips printed or otherwise mountedthereon.

The term “selective electronic circuit board” shall be usedinterchangeably with “selective electronic switch circuit board” and“selective electronic switch circuitry” and shall refer to a solid stateelectronic switch circuitry which may be addressed from an inactivatedstate, to an activated state by the action of an operator at a remotelocation, and desirably by an action in which the switch circuitry isaddressed via a specific electronic, digital, or wavelength-type controlsignal. The selective electronic switch circuit board/circuitry includesmicroprocessor technology. In an embodiment, the selective electronicswitch circuitry contemplated will not need to be selected or addressedin a particular sequence within a perforating gun assembly, and theaddressing of the selective electronic switch circuitry will not bedependent on the prior addressing of a physically adjacent selectiveelectronic switch circuitry in an immediately adjacent perforating gunmodule. The term selective electronic switch circuit board/circuitryshall for the purposes of this application, not encompass the term “pincontact” for communicating with pin firing assemblies and which mightphysically extend out from a selective electronic switch circuitry, or a“wiring arrangement” for directing power, communications and groundfunctionality to other components of a perforating gun select fire subassembly, and which might extend out from a selective electronic switchcircuitry, or a “common ground contact,” which might extend out from theselective electronic switch circuitry, and which is designed to providea general ground for the solid state electronics making up the selectiveelectronic switch circuitry.

The term “sealed” shall for the purposes of this disclosure, meanprotection from detrimental influence of surrounding environmentalconditions. Such protection shall include at least, protection fromdifferences in pressure. In other embodiments, such protection may alsoinclude protection from one or more of temperature differences,fluid/moisture differences, electrical charge variations, and physicalshocks. While connections between structural elements described in thisdisclosure and the enclosures themselves are sealed, particular emphasishas been provided with respect to certain connections and enclosures inorder to emphasize this point. For example, while described enclosuresmay include internal elements, which extend through walls/edges of theenclosures, it should be understood that those internal elements (suchas pin contacts, common ground contacts, ground arms, and wiringarrangements) extend outward from the enclosures through otherwisesealed regions of the enclosures (and without compromising the bodyseals). Their extension outward through the edges/walls does notnegatively impact the seal maintained by such connection or enclosure.

The disclosed pressure bulkhead structure, with integrated selectiveelectronic switch circuitry, provides structural protection forsensitive electronics so as to more easily allow the assembly and use ofperforating gun assemblies having significantly safer and more reliabledetonation technology. Similarly, the disclosed inner pressure-isolatingenclosure for specifically housing an integrated selective electronicswitch circuit board and related circuitry, also provides structuralprotection to the board and circuitry. By integrating selectiveelectronic switch circuitry technology within a pressure bulkheadstructure or, in some embodiments, within an internal component of apressure bulkhead structure that is itself contained within the outerhousing of the pressure bulkhead structure, rather than as part of othergun assembly components (or separated switch circuitry designs), theselective electronic switch circuitry technology may be protected fromboth the jarring movements encountered while conveying such assembliesinto/through a wellbore, the jarring movements encountered whiledetonating adjacent assemblies, and from the surrounding deleteriousconditions of a wellbore itself.

For purposes of illustrating features of the embodiments, simpleexamples will now be introduced and referenced throughout thedisclosure. Those skilled in the art will recognize that these examplesare illustrative and not limiting and are provided purely forexplanatory purposes. As other features of a perforating gun assemblyare generally known (such as detonator and shaped charge designstructures), for ease of understanding of the current disclosure thoseother features will not be otherwise described herein except byreference to other publications as may be of assistance.

Turning now to the figures, FIGS. 1A and 1B illustrate an exemplarypressure bulkhead structure 10. The pressure bulkhead structure 10 maybe used in a select fire sub assembly of a perforating gun (not shown).The pressure bulkhead structure 10 includes a pressure-isolatingenclosure 29 having a pressure-isolating enclosure body 30 thatsurrounds/encases a selective electronic switch circuitry 37.

According to an aspect, the pressure-isolating enclosure body 30 isformed about the selective electronic switch circuitry 37 so that thereare no spatial gaps between the pressure-isolating enclosure body 30 andthe selective electronic switch circuitry 37. In an embodiment, thepressure-isolating enclosure body 30 is formed from at least one of apolymeric material, a thermoplastic material, and an elastomericmaterial. The pressure-isolating enclosure body 30 may be formed of arigid material, such as a rigid thermoplastic. Examples of thermoplasticmaterials useful to form the pressure-isolating enclosure body 30 (andother components as will be discussed hereinbelow), may includepolyethylene (PE), polypropylene (PP), polycarbonate (PC), polyvinylchloride (PVC), polystyrene (PS), nylon (aka polyamide (PA)), polyester(typically polyethylene terephthalate (PET)), polyalkelene glycol (PAG)with or without glass fiber, polyetheretherketone (PEEK), or silicone.These materials are available as a homopolymer, co-polymer orreinforced. Examples of useful nylon include nylon 6 (PA6), nylon 66(PA66), nylon 6/6-6, nylon 6/9, nylon 6/10, nylon 6/12, nylon 11, nylon12. Nylons may also be blended with other engineering plastics toimprove certain aspects of performance. Nylon is well suited forprocessing via injection molding, rotational molding, or casting. Usefulpolyethylene compounds include high density polyethylene (HDPE), lowdensity polyethylene (LPDE) and linear low density polyethylene (LLPDE).According to an aspect, the glass fibers are present in an amount ofabout 15% to about 30% of the total weight (mass) of PAG. Alternatively,the pressure-isolating enclosure body 30 is made of a conformable orgel-like material, which demonstrates some elasticity when slightlydepressed. Such elasticity may provide additional shock resistance forsolid state electrical analog or digital components contained, housed,or otherwise enclosed by the pressure-isolating enclosure body 30. In anembodiment, the pressure-isolating enclosure body 30 encases theselective electronic switch circuitry (circuit board) 37 so that itcomes in contact with all outer surfaces of the selective electroniccircuit board 37, rather than merely be bonded to its outer perimeterside edges (such as, along one or more of the four side edges of arectangular circuit board supporting circuit/microprocessor components).

In an embodiment, the pressure-isolating enclosure body 30 isconstructed of a singular material. The pressure-isolating enclosurebody 30 may be constructed so that no manufacturing seams are presentwithin or along the pressure-isolating enclosure body 30. Thepressure-isolating enclosure body 30 may be injection-molded over theselective electronic switch circuitry, potted, or alternatively,3D-printed over the selective electronic switch circuitry 37, in orderto provide a desired seal that protects the selective electronic switchcircuitry 37 from potentially detrimental influence of surroundingenvironmental conditions, such as those of the wellbore.

While we have generally described that the pressure-isolating enclosurebody 30 may be formed of a singular material through, for instance, aninjection-molded process, given the sensitivity of the solid stateelectronics of the selective electronic switch circuit board 37, it iscontemplated that a two-step injection molding process may be used toform the pressure-isolating enclosure body 30. The pressure-isolatingenclosure body 30 may be formed from two different materials. In anembodiment, the pressure-isolating enclosure body 30 includes afirst/inner layer of injection molding material adjacent the selectiveelectronic switch circuit board 37, and a second/outer layer ofinjection molding material adjacent the first layer. The first layer maybe formed from any injection molding material having a meltingtemperature of less than about 180° C. The first layer completely coversthe selective electronic switch circuit board 37, and any active andpassive components mounted onto any of its surfaces, so that thecomponents are protected from the surrounding environmental conditionson the wellbore. When the injection molding material forming the firstlayer is heated above its melting temperature, it essentially takes theform of a liquid and is able to conform to the shape of the selectiveelectronic switch circuit board 37 and the solid state electronicsand/or the active and passive components mounted thereto. According toan aspect, the first layer of injection molding material completelyfills any gaps or spaces on the circuit board 37, as well as spacesbetween the components of the selective electronic switch circuit board37. The first layer of injection molding material may function as asubstrate for the outer layer of injection molding material, so that theouter layer is affixed to or extends from the first layer. In anembodiment, the first layer includes a PE compound, such as, HDPE, LPDE,and LLPDE. Alternatively, the first layer may be formed from PP, PE andthe like. The second layer is positioned adjacent the first layer, andprovides additional structural strength to the pressure-isolatingenclosure body 30. According to an aspect, the second layer of injectionmolding material is directly connected to or integrally formed with thefirst layer, so that the first and second layers cannot be easilyseparated from each other. The second layer is formed from a highstrength injection molding material having a melting temperature of atleast about 300° C. According to an aspect, the outer layer includesPA6, PA66, PET and the like. The second layer helps to insulate thefirst layer and the encased selective electronic switch circuit board37, as well as the solid state electronics and/or the active and passivecomponents, from the high temperatures of the wellbore.

The pressure-isolating enclosure body 30 includes a sealed first end 32and a sealed second end 34. In an embodiment, the pressure-isolatingenclosure body 30 is of a generally cylindrical shape, having anelongated body portion 31. The elongated body portion 31 extends betweenthe sealed first end 32 and the sealed second end 34 along alongitudinal direction L of the enclosure body 30, and the selectiveelectronic switch circuitry 37 is generally centrally disposed withinthe elongated body portion 31. The pressure-isolating enclosure body 30further includes an outer circumference, and one or more O-rings 42 arepositioned about the outer circumference. According to an aspect, and asillustrated in FIGS. 1A and 1B, the O-rings 42 are each positioned in acircumferential groove 43 formed in an outer edge 33 of thepressure-isolating enclosure body 30. The circumferential groove 43 maybe depressions that extend around the outer circumference of thepressure-isolating enclosure body 30, and help retain the O-rings 42 ina desired location.

As described hereinabove, the pressure bulkhead structure 10 includes aselective electronic switch circuitry 37 that is encased within thepressure-isolating enclosure body 30. The pressure-isolating enclosurebody 30 and selective electronic switch circuitry 37 form anintegrated/self-contained modular unit for use with various bulkheadstructure designs. Such integrated modular unit allows for the use of aselective electronic switch circuitry without the need to incorporatecircuitry directly with detonators and/or other format-specificcomponents of a perforating gun.

As seen in FIGS. 1A and 1B, the selective electronic circuitry 37includes a circuit board (in phantom) on which circuit components arepositioned. The selective electronic switch circuitry 37 may beconstructed of any known circuit board construction materials, as wouldbe understood by one of ordinary skill in the art. The selectiveelectronic switch circuitry 37 is immune to RF frequencies and/orunwanted direct and indirect stray voltage and stray current. Theselective electronic switch circuitry 37 is encased within thepressure-isolating enclosure body 30 and positioned between the sealedfirst and second ends 32, 34, so that it is immovable and sealedtherein. The sealed first and second ends 32, 34 of the body 30 preventexternal pressure or environmental conditions of the wellbore fromimpacting the selective electronic switch circuitry 37.

The pressure bulkhead structure 10 includes an electrical connector 38,which extends from the selective electronic switch circuitry 37. Atleast a portion of the electrical connector 38 is sealed within thepressure-isolating enclosure body 30, with another portion extendingthrough the sealed first end 32 of the elongated body portion 31 of thepressure-isolating enclosure body 30. The electrical connector 38 may beone of a wire (or wire electrical connector) 38A and a pin contact 38B.As seen for instance in FIGS. 1A and 1B, the wire electrical connector38A is electrically connected to (i.e., in electrical communicationwith) the selective electronic switch circuitry 37. The wire electricalconnector 38A or the pin contact 38B may be a down hole facing connectorthat provides an electrical connection to an adjacent perforating gunmodule. It is also contemplated that the pressure bulkhead structure 10may enclose a down hole facing pin assembly 50 (see, for instance, FIG.4). As seen for instance in FIGS. 4-5, 8B, 8C and 8D, the electricalconnector 38 may be arranged so that it is adjacent the down hole facingpin assembly 50.

The pressure bulkhead structure 10 may also include a wiring arrangement39 and a common ground contact 39D, which each extend from the selectiveelectronic switch circuitry 37 along the longitudinal direction L of theenclosure body 30, and through the sealed second end 34. The wiringarrangement 39 may have a three-wire arrangement, which includes anoutwardly directed detonator power line 39A (i.e., line-out), adetonator ground line 39B (i.e., ground), and a communications line 39C(i.e., line-in or hot wire). The arrangement and materials selected toform the common ground contact 39D enables the common ground contact 39Dto make electrical contact, directly or indirectly, with the select firesub assembly of the perforating gun. As illustrated in FIGS. 1A and 1B,a collar 36 extends from the sealed second end 34. The common groundcontact 39D may wrap about the collar/edge 36 of the sealed second end34 (as seen, for instance, in FIG. 1B) so that it makes electricalcontact with the select fire assembly. While the common ground contact39D is illustrated as a wire/ground wire, it is contemplated that thecommon ground contact 39D may be a substantially flat piece of material.To be sure, the common ground contact 39D may be formed into any shapethat enables it to flexibly bend or wrap around the collar 36. By havinga defined part of the select fire sub assembly of the perforating gun,i.e. the collar 36, for receiving the common ground contact 39D, thecommon ground contact 39D is able to provide continuous electricalconnection with the select fire sub assembly. In addition, the commonground contact 39D may be easily removed and repositioned on the collar36, without being torn, crimped and/or nicked during installment and/oruse of the select fire sub assembly. While the common ground contact 39Dmay be manufactured from a variety of metals, in an embodiment thecommon ground contact 39D is formed from copper, stainless steel,aluminum and/or brass.

FIGS. 2 and 3A-3B illustrate a further embodiment of the pressurebulkhead structure 10. For purposes of convenience, and not limitation,the various features, attributes, and properties, and functionality ofthe pressure-isolating enclosure 29 (including the pressure-isolatingenclosure body 30), the selective electronic switch circuitry 37, theelectrical connector 38, and the wiring arrangement 39 discussed inconnection with FIGS. 1A and 1B are not repeated here.

FIGS. 2 and 3A-3B illustrate the pressure bulkhead structure 10including a plurality of ground arms (fingers or protrusions) 70. It iscontemplated that the ground arms 70 are partially formed from the samematerial used to form the selective electronic switch circuitry 37. Forinstance, the ground arms 70 may be formed by stamping, cutting out, orwet chemically etching a centrally extending section of the selectiveelectronic switch the circuit board 37, thereby leaving lateral portionsthat help to form a portion of the ground arms 70. The ground arms 70each extend from the selective electronic switch circuitry 37 throughthe sealed second end 34. In an embodiment, the ground arms extend alongthe longitudinal direction L of the enclosure body 30.

Each ground arm 70 has a fixed end 72 and a free end 74. The fixed end72 may extend directly from the selective electronic switch circuitry37, while the free end 74 is at least able to engage with materials orsurfaces external to the pressure bulkhead structure 10 (see, forinstance, FIG. 9). As seen in FIGS. 3A-3B, the free end 74 at leastpartially extends through the sealed second end 34. In thisconfiguration, the ground arms 70 may make electrical ground contactwith, for example, a select fire sub assembly 600 of a perforating gunassembly (see, for instance, FIG. 9). A contact pad 75 is coupled to orotherwise extends from the free end 74. The contact pad 75 may be formedof a conductive material, such as copper or a gold-plated material, andmay be configured as a generally flat plate or cap that is affixed tothe free end 74. According to an aspect, the contact pads 75 are clippedon, chemically vapor deposed, or otherwise coupled to, the free ends 74of each of the ground arms 70. When the pressure bulkhead structure 10is arranged in, for example, the perforating gun select fire subassembly 600, the contact pads 75 make electrical connections withcorresponding electrically conductive materials within the sub assembly600. This eliminates the need for additional ground wires and othercomponents to make the electrical connection.

FIGS. 2 and 3A illustrate two ground arms, namely a first ground arm 71a and a second ground arm 71 b. According to this embodiment, eachground arm 71 a, 71 b is integrally formed with the selective electronicswitch circuitry 37, and is bilaterally spaced apart at a distance fromeach other, thereby creating a gap or space for receiving the wiringarrangement 30. Thus, the wiring arrangement 39 may be positionedbetween the first and second ground arms 71 a, 71 b in a sandwich-typeconfiguration. In other words, the first and second ground arms 71 a, 71b are at least spaced apart from each other at a distance that issubstantially the same as a width of the wiring arrangement 39. Thefirst ground arm 71 a may be arranged so that it is parallel to thesecond ground arm 71 b, which may be effective to help guide the wiringarrangement 39 in a desired orientation and/or maintain the wiringarrangement 39 in place.

One or more of the ground arms 70 may include a plurality of contactapertures 78. The contact apertures 78 extend from the upper surface tothe lower surface of the selective electronic switch circuitry 37. Asillustrated in FIGS. 2 and 3A, the apertures 78 may include anelectrically conductive material coated on their inner surfaces. Theelectrically conductive material may include copper, gold, and the like.These coated apertures 78 help to ensure that the electrical connectionand/or signals can pass through the upper surface and lower surfaces ofthe selective electronic switch circuitry 37.

Embodiments of the disclosure are further directed to a perforating gunassembly (not shown) that includes the aforementioned bulkheadstructures 10 of FIGS. 1A-1B, and FIGS. 2 and 3A-3B. The bulkheadstructures 10 may be for placement in a select fire sub assembly of aperforating gun module, and may form a pressure-isolating chamberbetween sequential perforating gun modules. The bulkhead structures 10,and well as any associated select fire sub assemblies including suchbulkhead structures, may be isolated from the surrounding environmentalconditions, including pressure changes, wellbore temperature andfluid/moisture, electrical charge variations, and physical shocks. Inthis embodiment, the bulkhead structure 10 is similar to the bulkheadstructures 10 illustrated in FIGS. 1A and 1B, and FIGS. 2 and 3A-3B, anddescribed hereinabove. Thus, for purposes of convenience, and notlimitation, the various features, attributes, and properties, andfunctionality of the bulkhead structures 10 discussed in connection withFIGS. 1A and 1B, and FIGS. 2 and 3A-3B are not repeated here.

The pressure-isolating enclosure body 30 may further include an outeredge 33 and an inner edge 35. The inner edge 35 defines an interiorspace 44 within the pressure-isolating enclosure body 30. According toan aspect, the selective electronic switch circuitry 37 is positionedwithin the interior space 44, so that it is immovable and securedtherein. The selective electronic switch circuitry 37 is connected to atleast one initiator/detonator. The detonators may include aresistorized/electric detonator, an electronic detonator, a 50 Ohm safedetonator, and a detonator using a fire set, an EFI, an EBW, asemiconductor bridge and/or an igniter.

The bulkhead structure 10 of the perforating gun assembly may includethe electrical connector 38, such as the wired electrical connector 38Aillustrated in FIGS. 1A and 1B, and the wiring arrangement 39. In anembodiment, the bulkhead structure 10 includes a ground feature. Theground features may include one of the common ground contact 39Dillustrated in FIGS. 1A and 1B and the ground arms 70 of FIGS. 2 and3A-3B. The wiring arrangement 39 may provide electrical communicationconnection between the selective electronic switch circuitry 37 andother components outside the pressure-isolating enclosure body 30, whilethe common ground contact 39D or the ground arms 70 electricallycontacts the sub assembly. According to an aspect, the common groundcontact 39D and the ground arms 70, when either is used, makeselectrical contact with at least one of a body of the sub assembly andan inner surface of the sub assembly. In an embodiment the ground arms70 may make electrical ground contact with the select fire sub assembly,and in turn, the perforating gun body. To be sure, when common groundcontacts 39D are used, they may make a similar electrical groundcontact.

Embodiments of the disclosure are further directed to a modular pressurebulkhead structure 10′ (and enclosed modular internal component) for usein a perforating gun select fire sub assembly. In the illustrativeexample and as seen in the partial, side cross-sectional view of FIG. 4,the pressure bulkhead structure 10′ has a longitudinal direction L, atransverse direction T, and a depth direction Z. The pressure bulkheadstructure 10′ as illustrated, is of a generally cylindrical overallshape, and includes an outer pressure-isolating enclosure (or outerhousing) 11. The outer-pressure isolating enclosure 11 has an outer walledge 12 and an inner wall edge 18 (as more clearly seen in FIG. 5). Theinner wall edge 18 defines an interior cavity 22 within theouter-pressure isolating enclosure 11 (and the pressure bulkheadstructure 10′). The outer pressure-isolating enclosure 11 itself, isshown having a generally elongated cylindrical body 16, including afirst end 13 and a second end 14. As illustrated in FIG. 4, thegenerally elongated cylindrical body 16 is desirably of a single piececonstruction. Located along the periphery of the elongated body 16 isone or more pressure stabilizing devices/mechanisms (or pressure sealingfeatures/structures) 15, such as the two illustrated O-rings 15, whichare seated in externally-directed, circumferential grooves 17 containedalong the outer wall edge 12 of the generally elongated body 16. Theouter pressure-isolating enclosure 11 is desirably formed from aconductive non-corrosive material, such as the metal aluminum.Alternatively, it may be formed of a rigid thermoplastic materialcontaining conductive material throughout, or of strategicallypositioned conductive material (so as to make contact with a commonground described below). Other potential construction materials of theouter pressure-isolating enclosure 11 include for example, brass,copper, stainless steel, aluminum, PEEK, and the like.

At the first end 13 of the generally elongated body 16, is seated a pinassembly 50. The pin assembly 50 is held tightly within an opening ofthe first end 13, such that no spatial gaps, which might compromiseelectronic circuitry contained within the interior cavity 22 of thepressure bulkhead structure 10′, are formed at the first end 13. Theillustrated pin assembly 50 is formed from traditional pin technologyand includes a mechanical pin 51 (shown in perspective), and a pin seat52 (shown in cross-section). The pin seat 52, as with the outerpressure-isolating enclosure 11, includes pressure sealingstructures/mechanisms 53, such as one or more O-rings 53. Two O-rings 53are illustrated seated in externally-directed circumferential grooves52B formed in an externally-facing wall 52A of the pin seat 52. The pin51 is conformably situated within the pin seat 52, and the resulting pinassembly 50 is conformably situated within the opening of the first end13 of the generally elongated body 16 of the outer pressure-isolatingenclosure 11. The pin assembly 50 lies adjacent a shelf-like structure(or internal collar) 54 defined along the inner wall edge 18 of theouter pressure-isolating enclosure 11. Specifically, the shelf-likestructure 54 defines an annular opening in which the pin seat assembly50 (including at least the pin seat 52, and in some instances the pin51) may be situated. The pin 51 and pin seat 52 are formed respectivelyfrom traditional pin and pin-seat forming materials. For example, in anembodiment, the pin 51 is formed of a metal or metal alloy such asbrass, while the pin seat 52 is formed from an injection moldedpolymeric material or machine plastic, such as those describedhereinabove in detail. Desirably, in manufacturing, the pin assemblywould be over molded with a heat resistant thermoplastic material suchas for example PEEK, or PAG with glass fiber for additional protection,and include at least one pressure stabilizing device (such as an O-ring)about its outer surface as shown. The pin assembly 50 is insulated fromthe outer pressure-isolating enclosure 11 of the pressure bulkheadstructure 10′. The pin 51 of the pin assembly 50 is connected to anadjacent perforating gun module (in a series of sequential perforatinggun modules) to enable selective initiation of individual gun assembliesin the tool string. Such perforating gun modules are, for instance,described in U.S. Pat. No. 9,494,021 to Parks et al.

In an embodiment, as shown in FIG. 4, the inner wall edge 18 of theouter pressure-isolating enclosure 11 includes optional female threads19 adjacent the second end 14, for receiving a threaded retainer 60(having male threads 61 that conform with the female threads 19 alongthe inner wall edge 18). The optional threaded retainer 60 shown incross-section in FIG. 4, is of an annular shape, in that it includes anoptional pass-through/annular opening 62 (such as the opening defined bythe elevated collar feature shown in FIG. 4) for passage of anelectrical wiring arrangement 39 from selective electronic switchcircuitry 37 contained within the pressure bulkhead structure 10′ (ormore precisely within a modular interior unit 29′ (described below as aninner pressure-isolating enclosure) contained within the interior cavity22 of the pressure bulkhead structure 10). In an alternative embodiment,the optional threaded retainer 60, may be solid (not shown), rather thandefining an annular opening 62. In such an alternative embodiment, thewiring arrangement 39′ from selective electronic switch circuitry 37′may pass through other channels within the pressure bulkhead structure10′. The threaded retainer 60 may be formed from any of a variety ofmaterials, such as for example molded thermoplastic polymer(s), or amachined metal. The threaded retainer 60 forms a tight seal at thesecond end 14 and in an embodiment, includes an upper edge 63 that isflush with the edge of the outer pressure-isolating enclosure 11 whenthe threaded retainer 60 is fully fastened in place (as shown). Ratherthan including a threaded retainer 60, the pressure bulkhead structure10′ may alternatively include a cap-like component. Still in a furtherembodiment, the pressure bulkhead structure 10′ may be configured ofmultiple pieces itself (without a retainer), which togethersubstantially surround the interior cavity 22. In yet a furtherembodiment, the pressure bulkhead structure 10′ does not include eithera retainer or multiple piece construction, but rather a wall of aninternally housed body (described below) makes up part of the second end14 of the outer pressure-isolating enclosure.

The pressure bulkhead structure 10′ may include an innerpressure-isolating enclosure 29′ (shown in perspective in FIGS. 5-6).The inner pressure-isolating enclosure 29′ includes an innerpressure-isolating enclosure body 30′, selective electronic switchcircuitry 37′ (circuit board), a pin contact 38B extending from theselective electronic switch circuitry 37′, a wiring arrangement 39′(encompassing 39A-C) extending from the selective electronic switchcircuitry 37′, and a common ground contact 39D extending from theselective electronic switch circuitry 37′. At least a portion of each ofthe pin contact 38B, the wiring arrangement 39, and the common groundcontact 39D is situated within the interior cavity 22 of the outerpressure-isolating enclosure 11 (of the overall pressure bulkheadstructure 10′). The inner pressure-isolating enclosure body 30′ may beof a generally cylindrical shape, having an elongated body portion 31′.In an embodiment, the inner pressure-isolating enclosure body 30′ has acapsule-like shape with outer dimensions and tolerances that allows itto closely fit within the interior cavity 22 of the outerpressure-isolating enclosure 11. It is contemplated that the innerpressure-isolating enclosure body 30′ may conform or press-fit to/withthe shape of interior cavity 22 of the outer pressure-isolatingenclosure 11. The inner pressure-isolating enclosure 30′ may be formedof conformable materials that are similar to those used to form thepressure-isolating enclosure 30 illustrated in FIGS. 1A and 1B, anddescribed hereinabove. Thus, for purposes of convenience, and notlimitation, the various features, attributes, and properties, andfunctionality of such materials discussed in connection with FIGS. 1Aand 1B are not repeated here. If the inner pressure-isolating enclosurebody 30′ is manufactured from conformable materials, such as elastomericpolymers, the relaxed outer dimensions of the inner pressure-isolatingenclosure body 30′ (containing the selective electronic switch circuitry37′, portions of pin contact 38A, wire arrangement 39′, and commonground contact 39D), may actually be slightly larger (or withinpress-fit tolerances) than the dimensions of the interior cavity 22,prior to the actual insertion of the inner pressure-isolating enclosurebody 30′ into the interior cavity 22 of the outer pressure-isolatingenclosure body 11. In this fashion, the inner pressure-isolatingenclosure body 30′ may serve as a module-like component that can beeasily positioned within a variety of shaped/dimensioned pressurebulkhead structures. Depending on desired construction technique, theinner pressure-isolating enclosure body 30′ encases the selectiveelectronic switch circuitry (circuit board) 37, rather than merely bebonded to its outer perimeter side edges. In an alternative embodiment,the inner pressure-isolating enclosure body 30′ encases the selectiveelectronic circuit board 37′, so that it is in contact with all outersurfaces of the selective electronic circuit board 37′.

The inner pressure-isolating enclosure body 30′ has a sealed first end32′ which, when placed in the pressure bulkhead structure 10′, issituated adjacent the pin assembly 50, and in particular, immediatelyadjacent a pin assembly receiving collar (a shelf-like structure) 54located adjacent the first end 13, the collar 54 projecting from theinner edge 18 of the outer pressure-isolating enclosure 11. The pincontact 38B, which is in electrical connection to the selectiveelectronic switch circuitry 37′, extends through the sealed first end32′ and the opening of the receiving collar 54 to the pin 51. The innerpressure-isolating enclosure body 30′ also includes a sealed second end34′ for positioning in the pressure bulkhead structure 10′, adjacent anoptional threaded retainer 60 if present, or at least adjacent the outerpressure-isolating enclosure 11 (elongated body 16), second end 14. Botha wiring arrangement 39′, and a common ground contact 39D extend fromthe selective electronic switch circuitry 37′ and out of the body 30′through the sealed second end 34′. The sealed first and second ends 32,34 of the body 30 together prevent external pressure and/orenvironmental conditions of the wellbore from impacting the selectiveelectronic switch circuitry 37′. The inner pressure-isolating enclosurebody 30′ includes an outer edge 33′, which lies adjacent the inner edge18 of the outer pressure-isolating enclosure 11, and an inner edge 35′(seen in FIG. 7). In an embodiment, it is desirable for the outer edge33′ to include few, if any, spatial gaps between it and the inner edge18 of the outer pressure-isolating enclosure 11, so that it will beunlikely for the inner pressure-isolating enclosure body 30′ (or itscontents) to shift during sudden movement of the pressure bulkheadstructure 10′. The reduction of special gaps may be the result of apress-fit type arrangement of the inner pressure-isolating enclosurebody 30′ and the outer pressure-isolating enclosure 11. One or morepressure stabilizing structures/features 42′ (such as the two O-ringsillustrated) may be seated in circumferential, outer grooves 43′ of theouter edge 33′ of the inner pressure-isolating enclosure body 30′. Theinner edge 35′ of the inner pressure-isolating enclosure body 30surrounds a selective electronic switch circuitry 37′. Depending on theembodiment, the inner edge 35 may be in direct contact with theselective electronic switch circuitry 37′ on all sides, or may define avoid space in which the selective electronic switch circuitry 37′ islocated. The inner edge 35′ may be held in immovable contact with theselective electronic switch circuitry 37′ along one to six side edges(such as for the rectangular circuit board illustrated). For example,depending on the manufacturing method of the inner pressure-isolatingenclosure body 30′, there may be no gaps between the inner edge 35′, theselective electronic switch circuitry 37′, a portion of the pin contact38B, portions of the extending wiring arrangement 39′, and portions ofthe common ground contact 39D. As described hereinabove with respect toFIGS. 1A-1B, and as illustrated in FIGS. 2 and 3, the selectiveelectronic circuitry 37, 37′ includes a circuit board (in phantom) onwhich circuit components are positioned.

As more clearly seen in FIGS. 4 and 5 which illustrate a perspectiveview of the inner pressure-isolating enclosure 29′, and partial top,cross-sectional view of the pressure bulkhead structure 10′respectively, in an embodiment, the sealed first end 32′ of the innerpressure-isolating enclosure body 30′ includes a tapered portion 32Athat is tapered towards the outer pressure-isolating enclosure first end13 (and pin assembly 50), although it need not be. The pin contact 38Bextends through the sealed first end 32′, to make contact with the pinof the pin assembly 50. The pin contact 38B extends from the selectiveelectronic switch circuitry 37′ (described further below) housed withinthe inner pressure-isolating enclosure body 30′. In an embodiment, thesealed second end 34′ of the inner pressure-isolating enclosure body 30′also includes a taper, so that it is tapered outward towards the outerpressure-isolating enclosure second end 14, although it need not be. Asillustrated in FIGS. 2-4, the sealed second end 34′ includes anoutermost flattened portion 34A or ridge, a tapered portion 34B, and acollar structure 36′ that forms an encircling seal about the wiringarrangement 39′ (and common ground contact 39D). The threaded retainer60 surrounds the collar structure 36′.

As illustrated in FIGS. 2-5, each sealed end 32′, 34′ of the innerpressure-isolating enclosure body 30′ allows components to pass eitherto the pin assembly, or alternatively to detonators/other externallylocated components (such as the outer pressure-isolating enclosure 11).The wiring arrangement 39′ and the common ground contact 39D passthrough the sealed second end 34′. The wiring arrangement 39′ extendsfrom the selective electronic switch circuitry 37′ to an additionalperforating gun select fire sub assembly component, such as a detonatoror other components. The common ground contact 39D is directed over thecollar 36′ to a location either under the threaded retainer 60 so thatit can be in electrical connection with the retainer (if it is formed ofa conductive material) which itself is in electrical connection with theouter pressure-isolating enclosure 11/pressure bulkhead structure 10′,or alternatively, over the collar 36′ and the threaded retainer 60 suchthat it is in direct electrical connection/communication with the outerpressure-isolating enclosure 11/pressure bulkhead structure 10′ (whichis also in contact with the select fire assembly 80 described below). Inan embodiment, the common ground contact 39D extends from the selectiveelectronic switch circuitry 37′ over the collar 36′ and the retainer 60,such that it may make direct electrical contact with conductive materialin the select fire assembly 80.

In an embodiment, the inner pressure-isolating enclosure body 30′ isseated immediately against the inner edge 18 of the outerpressure-isolating enclosure 11 at least along substantial portions ofthe longitudinal directions of both the inner and outerpressure-isolating enclosures. For example, the outer edge 33′ of theinner pressure-isolating enclosure body 30′ may extend between about anamount greater than 0 and 10 percent, alternatively between about 1 and15 percent of the longitudinal direction L of the outerpressure-isolating enclosure 11. In an embodiment, the length L1 of theoutwardly tapered portion 32A on the sealed first end 32′ of the innerpressure-isolating enclosure body 30′, is between about 1 and 15 percentof the entire length (between most distant points of the sealed first32′ and second end 34′) of the inner pressure-isolating enclosure body30′. In an embodiment, the length L2 of the outwardly tapered portion34B on the sealed second end 34′ of the inner pressure-isolatingenclosure body 30′, is between about 0.5 and 20 percent of the entirelength (between the most distant points of the sealed first 32′ andsecond end 34′) of the inner pressure-isolating enclosure body 30′. Asseen in FIG. 7, the length L2 of the outwardly tapered portion 34B islarger than the length L1 of the outwardly tapered portion 32A. In anembodiment, the sealed second end 34′ is sized to accommodate thepassage of both the wiring arrangement 39′ and the common ground contact39D.

The inner pressure-isolating enclosure body 30′ is in an embodiment, ofa unitary construction, in that it is formed of a single material. In anembodiment, the inner pressure-isolating enclosure body 30′ is formedwithout manufacturing seams. The inner pressure-isolating enclosure body30′ may be formed from a nonconductive material, such as, for example athermoplastic polymeric material. The inner pressure-isolating enclosurebody 30′ may be formed from polyolefin materials. In an embodiment, theinner pressure-isolating enclosure body 30′ is formed from PAG withglass fibers, PEEK, or silicone. Alternatively, such innerpressure-isolating enclosure body 30′ is formed from fluorocarbon (FKM).Alternatively, such body 30′ may be formed from, PC, PE, and the like.If such inner pressure-isolating enclosure body 30′ is formed from agel-like or elastomeric material, it may be formed from synthetic resin,and in an embodiment, materials that can withstand degradation attemperatures of between about 100° C. and 260° C., and externalpressures of between about 10,000 psi and 25,000 psi. The O-rings 42′that may be present in circumferential grooves 43′ on the outer edge 33′of the inner pressure-isolating enclosure body 30′ (as well as the otherpreviously described O-ring features), may be formed from varioussealing materials, such as for example, polymeric materials, naturalrubbers, silicones and such, and desirably of material capable ofwithstanding degrading at temperatures of between about 100° C. and 260°C.

The inner pressure-isolating enclosure body 30 may be manufactured by avariety of techniques depending on desired material(s) of constructionand desired performance attributes of the body. As noted, the materialsof construction may include for example, thermoplastics and siliconerubber gels. Such manufacturing techniques include for example,injection over-molding, blow molding, extrusion molding, rotationalmolding, three-dimensional printing, over-coating, and traditionalmulti-piece, adhesive type construction techniques. In an embodiment,such inner pressure-isolating enclosure body 30′ is manufactured usingan injection over-molding process that conforms the inner edge 35′ ofthe inner pressure-isolating enclosure body 30′ closely to the outerdimensions of the selective electronic switch circuitry 37′, a portionof the pin contact 38B peripheral edge, a portion of the wirearrangement 39′ peripheral edges, and a portion of the common groundcontact 39D peripheral edge, such that no spatial gaps exist between thecircuitry, pin contact, wire arrangement, common ground contact and theinner edge(s) 35′ of the inner pressure-isolating enclosure body 30′. Inan embodiment, the inner pressure-isolating enclosure body 30′ ismanufactured without seams, such as for example, by an injectionover-molding process (described in further detail hereinbelow). Theinner pressure-isolating enclosure body 30′ may be produced using atleast one of an injection over-molding manufacturing process, a pottingprocess, or a three-dimensional printing process (hereinafter 3Dprinting), such that it is directly formed about the selectiveelectronic switch circuitry 37′ contained and sealed therein. It iscontemplated that the inner pressure-isolating enclosure body 30′ may beformed using the two-step injection molding process describedhereinabove, so that the inner pressure-isolating enclosure body 30′includes a first layer (i.e., inner protective layer) of injectionmolding material adjacent the selective electronic switch circuit board37, and a second layer of injection molding material adjacent the firstlayer.

In an embodiment, the circuit board of the selective electronic switchcircuitry 37′ is positioned within the inner pressure-isolatingenclosure body 30′ such that at least one of its end edges is spacedapart from the sealed first and second ends 32′, 34′ of the innerpressure-isolating enclosure body 30′. For instance, as clearly seen inFIGS. 2 and 5, the circuit board of the selective electronic switchcircuitry 37′ is spaced apart along the longitudinal direction, from thesealed second end 34′, and terminates at a position within the body 30′removed from the tapered second end 34B, such that the threaded retainer60 does not sit over any portion of the selective electronic switchcircuitry and circuit board 37′ itself.

In this embodiment, the selective electronic switch circuitry 37′ issimilar to the selective electronic switch circuitry 37 illustrated inFIGS. 1A and 1B, and described hereinabove. Thus, for purposes ofconvenience, and not limitation, the various features, attributes andproperties, functionality, and construction of the selective electronicswitch circuitry 37′ discussed in connection with FIGS. 1A and 1B arenot repeated here.

The selective electronic switch circuitry 37′ (and accompanying circuitboard) for communicating, arming and initiating firing of theperforating gun, is housed within the inner pressure-isolating enclosurebody 30′. The selective electronic switch circuitry 37′ is immune to RFfrequencies and/or unwanted direct and indirect stray voltage andcurrent. In an embodiment, the selective electronic switch circuitry 37′is encased within the inner pressure-isolating enclosure body 30′ suchthat it is immovable within the inner pressure-isolating enclosure body30′ as well as the outer pressure-isolating enclosure 11. In analternative embodiment, such selective electronic switch circuitry 37′of the inner pressure-isolating enclosure body 30 is coated with aconformal coating as is known in the electronic arts. In any event, theselective electronic switch circuitry 37′ is desirably placed within theinner pressure-isolating enclosure body 30′ such that it is protectedfrom both shocks/vibrations, and other environmental conditions.

In an embodiment, the selective electronic switch circuitry 37 hasextending from it at least a wiring arrangement 39′ and one commonground contact 39D. According to an aspect, the wiring arrangement 39′is a three wire arrangement as illustrated. The wiring arrangement 39′(or electrical connection lines) includes an outwardly directeddetonator power line 39A (line-out), an outwardly directed detonatorground line 39B (ground), and a communications line 39C (line-in orhot-wire to detonator). The common ground contact 39D may also groundthe selective electronic switch circuitry 37′ to the outerpressure-isolating enclosure 11 and, in some embodiments, to the selectfire assembly 80, either directly or indirectly. The common groundcontact 39D wraps either about the collar/edge 36′ of the sealed secondend 34′ of the inner pressure-isolating enclosure body 30′ (and in someinstances the threaded retainer 60 if present) such that it can makeelectrical contact with either a metal threaded retainer 60 or the outerpressure-isolating enclosure 11 itself (which is desirably of metalconstruction in an embodiment). The outer pressure-isolating enclosure11 is in direct contact with the select fire assembly 80 (as will befurther described below).

As noted, FIG. 4 illustrates a partial cross-sectional view of apressure bulkhead structure 10′ in accordance with the disclosure. Inparticular, side cross-sectional views of the pin seat 52, outerpressure-isolating enclosure 11, and threaded retainer 60 are shown. Incontrast, a perspective view of the inner pressure-isolating enclosurebody 30′ and the pin 51 can be seen in the same figure, while theselective electronic switch circuitry 37′ can be seen in phantom. FIG. 5illustrates a partially exploded (and cross-sectional view) of anembodiment of the pressure bulkhead structure 10′. However, in contrastto the embodiment of FIG. 4, which illustrates the common ground contact39D wrapped about an edge of the threaded retainer 60, the common groundcontact 39D in FIG. 5 is shown wrapped about the edge of the collar 36′of the inner pressure-isolating enclosure body 30′ to make directcontact only to an unexposed surface of the retainer (which will be indirect contact with the outer pressure-isolating enclosure 11 conductivesurface).

As seen in FIG. 6, a perspective view of an inner pressure-isolatingenclosure 29′ is illustrated. The view also illustrates a wiringarrangement 39′ extending out from the selective electronic switchcircuitry 37′ and the enclosure body 30′, as well as a common groundcontact 39D extending from the circuitry 37′ that has been wrapped aboutthe collar 36′ located at the sealed second end 34′ of the enclosurebody 30′. The selective electronic switch circuitry 37′ can be seen inphantom within the enclosure body 30′. As seen in FIG. 7, a top, crosssectional view of the pressure bulkhead structure 10′ is illustratedshowing a top view of the selective electronic switch circuitry 37′,which transversely directed outer edge 37B is spaced inwardly from thetapered portion 34B of the sealed second end 34′ of the innerpressure-isolating enclosure body 30′. The threaded retainer 60 (whichincludes male threads to match the female threads 19 located along theinner edge 18 of the outer pressure-isolating enclosure 11) is situatedspaced apart from the transversely directed outer edge 37B of theselective electronic switch circuitry 37′ (when viewed along thelongitudinal direction L). The entire dimensions of the selectiveelectronic switch circuitry 37′ are defined by generally longitudinallydirected outer edges 37A and the transversely directed outer edges 37B.In an embodiment, at least the longitudinally directed outer edges 37Aare positioned immediately adjacent or in direct physical contact withthe inner edge 33′ of the inner pressure-isolating enclosure body 30′.In an alternative, all of the outer edges (along the longitudinal andtransverse directions) of the selective electronic switch circuitry 37′are immediately adjacent or in direct physical contact with the inneredge 33′ of the inner pressure-isolating enclosure body 30′. In still afurther alternative embodiment (as seen in FIG. 7A), all surfacesincluding all outer side edges and top and bottom surfaces of theselective electronic switch circuitry 37′ are immediately adjacent or indirect physical contact with the inner edge 33′ of the innerpressure-isolating enclosure 30′. Such direct contact can be achieved byseveral of the previously described manufacturing methods whichinjection over-mold, print or extrude the inner pressure-isolatingenclosure body 30′ about the selective electronic switch circuitry 37′.In yet a further alternative embodiment, the inner edge 33′ defines aninternal void space in the inner pressure-isolating enclosure body 30′,in which the selective electronic switch circuitry 37′ is located. Suchcircuitry can be either adhesively bonded, press-fit, or otherwise sizedto be immovably placed within the inner pressure-isolating enclosurebody 30′.

Desirably, in an embodiment, the inner pressure-isolating enclosure body30′ has outermost dimensions that allow it to conform tightly to thedimensions of the interior cavity 22 of the outer pressure-isolatingenclosure 11, such as those embodiments illustrated in the figures. Insuch embodiments, the relative thickness of the walls of the innerpressure-isolating enclosure body 30′ may vary along the longitudinaldirection, the transverse direction, the depth direction, or combinationof multiple directions, depending on the height of the circuitrycomponents along housed circuit boards. Essentially, in an embodiment,the selective electronic switch circuitry 37′ will be immovable withinthe inner pressure-isolating enclosure body 30′ as the walls of theenclosure body 30′ are conformably fit directly over the circuitry 37′,and also dimensioned to conformably fit within the interior cavity 22. Aside cross-sectional view of a pressure bulkhead structure 10′ is shownin FIG. 7A. As can be seen in the figure, the inner pressure-isolatingenclosure body 30′ is formed to entirely encase the selective electronicswitch circuitry 37′, with varying wall thicknesses along the length L,depending on circuitry features.

An alternative embodiment of a pressure bulkhead structure 110 can beseen in FIG. 6B. Such figure shows a side cross-sectional view of thepressure bulkhead structure 110. As can be seen in the figure, the innerpressure-isolating enclosure body 130 of the alternative embodiment caninclude two distinct over-molded layers, an outer layer 170 and an innerlayer 172. The inner layer 172 can directly encase the selectiveelectronic circuitry 37′. The two layers can be formed from differentpolymeric materials, such as for example, from two differentthermoplastic materials.

A further alternative embodiment of a pressure bulkhead structure 210can be seen in FIG. 7C. Such figure shows a side, cross-sectional viewof the pressure bulkhead structure 210. The pressure bulkhead 210includes an inner pressure-isolating enclosure body 230. The innerpressure-isolating enclosure body 230 includes a layer 274, which isattached to the selective electronic circuitry 37′ along the sidelongitudinal side edges 37A. A space 276 exists between the upper andlower surfaces of the circuitry 37′ and the layer 274.

An alternative embodiment of a pressure bulkhead structure 310 isillustrated in FIG. 8A. In the figure, a partial cross-sectional view ofthe pressure bulkhead structure 310 with integrated selective electronicswitch circuitry 37′ is shown. The pressure bulkhead structure 310includes an outer pressure-isolating enclosure 320 having a first end302 and a second end 303. A pin assembly 50 including a pin 51 and pinseat 52 (as previously described) is situated in an opening within thefirst end 302 of the outer pressure-isolating enclosure 320. Also as inprior embodiments, the pin assembly 50 is operatively connected to aselective electronic switch circuitry 37′ that is housed within an innerpressure-isolating enclosure body 330. The inner pressure-isolatingenclosure body 330 has a sealed first end 332 adjacent the pin assembly50 (and the outer pressure-isolating enclosure 320, first end 302) and asealed second end 334 adjacent the outer pressure-isolating enclosure320, second end 303. Rather than including a threaded retainer as in thepreviously described embodiments, the inner pressure-isolating enclosurebody 330 is sized to extend the entire dimension of the interior cavity22 of the outer pressure-isolating enclosure 320. Therefore the sealedsecond end 334 extends to a length that is flush with the second end 303of the outer pressure-isolating enclosure 320. The inner pressureisolating enclosure body 330 is therefore sized to immovably andcompletely fill the interior cavity 22. A wiring arrangement 39′ extendsfrom the selective electronic switch circuitry 37′ that is contained inthe inner pressure-isolating enclosure body 330, outwardly from thesealed second end 334. A common ground contact 329D extends through aside wall of the inner pressure-isolating enclosure body 330 to makeelectrical contact with an inner edge of the outer pressure-isolatingenclosure 320 (which is constructed with a conductive material, such asa metal). In an embodiment, the outer pressure-isolating enclosure 320is formed from a metal selected from the group including aluminum,titanium, brass, and steel. As with other previously describedembodiments, the pin 51 and circuitry 37′ are shown in perspective view.

A partial exploded, side cross-sectional view of the embodiment of FIG.8A is shown in FIG. 8B. As more clearly shown in this figure, the sealedsecond end 334 of the inner pressure-isolating enclosure body 330 isrelatively planar or flat in configuration, but need not be so. Incontrast, the sealed first end 332 includes a tapered portion aspreviously described. The design of this embodiment does not necessitateany additional retainer or cap-like device.

FIG. 8C illustrates a partial, cross-sectional view of a splittablepressure bulkhead structure 410 with integrated selective electronicswitch circuitry 37, according to another embodiment. The splittablepressure bulkhead structure 410 includes an outer pressure-isolatingenclosure 420, generally having a first end 402 and a second end 403.The outer pressure-isolating enclosure 420 is itself formed from twomated sections 405, 404 which may be held to one another along matededges 408, 409 (as seen in FIG. 8D). The mated edges 408, 409 may befastenable to one another via a threading arrangement (i.e. screwedtogether), by a snap-type or interlocking lock, or alternatively, by anadhesive application, or friction. The two mated sections may beasymmetrical in length as shown, or alternatively, symmetrical inlength. A pin assembly 50 including a pin and pin seat, is positioned inan opening at the first end 402 (as with previously describedembodiments, but in this embodiment specifically from the first end 402which is part of the mated section 405). As with previous embodiments,it is held sealed in place, and in electrical connection with a pincontact 38B that extends from the circuitry 37′, and through a sealedend of the inner pressure-isolating enclosure body 430. However, ratherthan also including a threaded retainer to hold the innerpressure-isolating enclosure body 430 in place, the innerpressure-isolating enclosure body 430 (which houses the selectiveelectronic switch circuitry 37′), is enclosed between the two matedsections 405, 404 of the outer pressure-isolating enclosure 420. Theinner pressure-isolating enclosure body 430 includes in this embodimenta sealed first tapered end 432A and a sealed second tapered end 434B,which are configured to fit in a conforming relationship within theinterior cavity surface formed from the mated outer pressure-isolatingenclosure sections 405, 404. As with previously described embodiments, awiring arrangement 39′ and common ground contact 429D extend from theselective electronic switch circuitry 37′ through a sealed second end434B of the inner pressure-isolating enclosure body 430. However, sincethe embodiment does not include a threaded retainer, the wiringarrangement 39′ extends through a sealed collar 436 at the second end403 of the outer pressure-isolating enclosure 420 (and specificallythrough section 404). In the embodiment illustrated in FIG. 8C, thecommon ground contact 429D also extends out from the selectiveelectronic circuitry 37′ through the sealed end 434B of the innerpressure-isolating enclosure body 430 and wraps about the collar 436 onsection 404 of the outer pressure-isolating enclosure 420, in order tomake electrical contact with the conductive outer pressure-isolatingenclosure 420 (which like previous embodiments is either entirely formedof a conductive material, or alternatively, partially formed of aconductive material). In another embodiment, only mated section 404 isformed of a conductive material. FIG. 8D illustrates an exploded,partial cross-sectional side view of a splittable pressure bulkheadstructure 420 with selective electronic switch circuitry 37′. The matededges 408, 409 can be more clearly seen in this figure. The pin 51 andinner pressure-isolating enclosure body 430 are illustrated inperspective view, while the circuitry 37 is shown in phantom. As seen inFIG. 8D, the common ground contact 429D is positioned underneath, but isstill in contact with section 404.

FIG. 8E is a partial, cross-sectional view of a capped pressure bulkheadstructure 510 containing a pin assembly 50 and integrated selectiveelectronic switch circuitry 37′ (itself housed within an innerpressure-isolating enclosure body 530) according to a furtherembodiment. The pressure bulkhead structure 510 includes an outerpressure-isolating enclosure 520 having a first end 502 and a second end503. A pin assembly 50 (as with previously described embodiments) issealed in an opening in the outer pressure-isolating enclosure 520 atthe first end 502. The inner pressure-isolating enclosure body 505includes a sealed first end 532A (that is illustrated as tapered)adjacent the pin assembly 50 and the outer pressure-isolating enclosurefirst end 502. As with prior embodiments, the pin of the pin assembly isadjacent to/in electrical connection with a pin contact extending fromthe inner pressure-isolating enclosure body 530, and specificallythrough the sealed first end 532A from the selective electronic switchcircuitry 37′ contained in the inner pressure-isolating enclosure body530. The inner pressure-isolating enclosure body 530 also includes asealed second end 534B (that is also tapered in the illustratedembodiment) that is adjacent the outer pressure-isolating enclosuresecond end 503. Rather than including a threaded retainer as in apreviously described embodiment, a removable end cap 590 is included inthis embodiment, which end cap 590 is held in a conforming relationshipwith the inner pressure-isolating enclosure body sealed second end 534B.The end cap 590 is seated on the sealed second end 534B of the innerpressure-isolating enclosure body 530 (and surrounded by the outerpressure-isolating enclosure second end 520 edge), such that a wiringarrangement 39′ may extend through a collar-like opening of the sealedsecond end 534B through a collar-like opening 591 in the end cap 590.The end cap 590 may be held in place by adhesive, frictional forces, orother bonding methods, or may alternatively be snapped into position,such that it is locked in place around the conforming shape of thesealed second end 534B. In a further alternative embodiment, the end cap590 may be held in place by a non-illustrated structure which exertspressure on it towards the sealed second end 534B, from a positionexternal to the pressure bulkhead structure 510. The end cap 590 may beformed from a conductive material, such as the metal aluminum. Asillustrated in FIG. 8E, a common ground contact 529D extends from theselective electronic switch circuitry 37 through the collared, sealedsecond end 534B of the inner pressure-isolating enclosure body 530, andis wrapped about the collar 536 and the collared opening 591 on the endcap 590. It is grounded by being exposed to the conductive material ofthe outer pressure-isolating enclosure 520 of the pressure bulkheadstructure 510. Alternatively, as shown in the partial, exploded sideview of FIG. 8F, the common ground contact 529D may simply be wrappedabout the collared sealed second end 534B of the innerpressure-isolating enclosure body 530. It is allowed to serve itsgrounding function as it is placed in direct contact with the innersurface of the conductive end cap 590 when the end cap is in position(which is itself in contact with the conductive material of the outerpressure-isolating enclosure 520). The pin and inner pressure-isolatingenclosure body 530 are shown in perspective view for ease of reference.

In each of the foregoing embodiments, a pressure bulkhead structure withan integrated selective electronic switch circuitry is disclosed suchthat the selective electronic switch circuitry is embedded within aninner pressure-isolating enclosure so as to form an integrated unit forsimplified manufacture/incorporation within an outer pressure-isolatingenclosure and ultimately, the macrostructure of a perforating gun selectfire sub assembly. The inner pressure-isolating enclosure (and containedcircuitry) is in a sense, a modular unit for easy installation, and onethat protects the solid state electronics from shocks and deleteriousenvironmental conditions. Similarly, the pressure bulkhead with theinner pressure-isolating enclosure is also a modular unit that can beinstalled in longer selective perforating gun tool-string assemblies.Such modular construction allows for the unit(s) to be placed in avariety of perforating gun systems while providing the safety andpredictability of selective electronic switch circuitry, as well asunidirectional pressure isolation. The modular unit may be manufacturedin an efficient manner, thereby providing cost-friendly options tooperators of such perforating gun equipment. By including an integratedcommon ground contact, pin contact (line-out to next gun module) andwiring arrangement (such as a line-in/hot-wire), the disclosed pressurebulkhead structure may be compatible with all electric/resistorizeddetonators, electronic detonators, 50 Ohm safe detonators, and/ordetonators using a fire set, an EFI, an EBW, a semiconductor bridgeand/or an igniter. The disclosed pressure bulkhead structure may becompatible with all electronic RF-safe detonators.

In order to more clearly put the disclosed pressure bulkhead structure10 in context, a perforating gun select fire sub assembly 600 containingthe disclosed modular pressure bulkhead structure 10′ (and modular innerpressure-isolating enclosure body 30) is illustrated in FIG. 9. As canbe seen in the partial cross-sectional, and exploded view of FIG. 9, thedisclosed pressure bulkhead structure 10′, having an outerpressure-isolating enclosure 11 and inner pressure-isolating enclosurebody 30′ can be seen located within the larger outer structure. Theouter pressure-isolating enclosure 11 surrounds at least a portion ofthe pin assembly 50, the inner pressure-isolating enclosure body 30′,and the retainer 60. The wiring arrangement 39′ extends from the switchcircuitry 37′ contained in the inner pressure-isolating enclosure body30′, through a channel in the select fire sub assembly 600 to eithergrounding locations, other connections, or detonator technology.According to an aspect, the wiring arrangement 39′ may include anadditional cable that connects with grounding devices/structures, suchas a ground screw, within the select fire sub assembly 600. The pressurebulkhead structure 10′ may be contained at one end of the larger subassembly 600, and particularly at region 80. The perforating gun selectfire sub assembly 600, which is itself part of a larger perforating gunassembly (including a series of gun modules/perforating gun assemblies),includes a first end 82 and a second end 84 that are positioned along agenerally longitudinally configured, cylindrical gun assembly body. Atthe first end 82, the select fire gun assembly defines an opening inwhich an annular threaded retainer 83 is used to hold the pressurebulkhead structure 10′ in place. The annular threaded retainer 83 isheld to internal threads within the assembly 600. The pin of the pinassembly 50 extends through the opening in the annular threaded retainer83. The threaded retainer 83 which is attached to the second end 14 ofthe pressure bulkhead structure 11 allows the wiring arrangement 39′ topass from the selective electronic switch circuitry 37′ to a detonator86 contained in a channel of the perforating gun select fire subassembly 600. As also seen in FIG. 9, the perforating gun select firesub assembly 600 itself includes multiple exterior regions withcircumferential grooves for holding additional pressure stabilizingdevices/mechanisms 615, 655. The perforating gun select fire subassembly 600 also includes multiple threaded portions 661 along itsexterior surface for attachment of the select fire sub assembly to alarger linked gun structure. The wiring arrangement 39′ extends to aregion adjacent the sub assembly 600 body through opening 664 (which isitself capped by a threaded cap 690).

For general ease of understanding, an exterior perspective view of thedisclosed pressure bulkhead structure 10′ can be seen in FIG. 8. The pincan be seen extending from the first end 13 of the outerpressure-isolating enclosure 11 of the pressure bulkhead structure 10,while the wiring arrangement 39′ can be seen extending from the secondend 14 of the outer pressure-isolating enclosure 11 of the pressurebulkhead structure 10. While the outer pressure-isolating enclosure 11can be seen in the figure, the inner pressure-isolating enclosure 29′(and body 30′) are not readily visible.

Embodiments of the disclosure are further directed to a method 1000 ofmanufacturing a pressure-isolating enclosure for placement as a pressurebulkhead structure of a perforating gun select fire sub assembly. Themethod includes providing 1010 a selective electronic switch circuitry.The selective electronic switch circuitry may be configuredsubstantially as described hereinabove, with particular references toFIGS. 1A and 1B, so such details are not described in detail here. Themethod 1000 further includes coupling 1020 an electrical connector to afirst end of the selective electronic switch circuitry and coupling awiring arrangement to a second end of the selective electronic switchcircuitry. The step of coupling 1020 may be performed so that theelectrical connector is spaced apart from the wiring arrangement, eachextending away from each other. The electrical connector may be one of awire electrical connector (see, for instance, FIGS. 1A and 1B) or a pincontact (see, for instance, FIGS. 3-4, 6B, 6D and 6D). The wiringarrangement may include an outwardly directed detonator power line, acommunications line, and a detonator ground line. A common groundcontact may be connected 1030 to the selective electronic switchcircuitry. The step of connecting 1030 the common ground contactincludes placing the common ground contact so that it extends from theselective electronic switch circuitry through the second end, in asimilar way as the wiring arrangement.

The method further includes depositing 1040 a material directly over orabout the selective electronic switch circuitry to form apressure-isolating enclosure body that is integrated with the selectiveelectronic switch circuitry. This depositing 1040 step is performed in amanner that ensures that there are no spatial gaps between the formedpressure-isolating enclosure body and the selective electronic switchcircuitry. According to an aspect, the depositing 1040 includes at leastone of an injection over molding process, a 3-D printing process, and anextrusion process or a potting process. The step of depositing 1040 mayinclude the step of injection over molding 1042 around and encompassingthe selective electronic switch circuitry using one of a polymericmaterial, a thermoplastic material, and an elastomeric material. Thisforms a pressure-isolating enclosure that has a sealed first end at thefirst end of the selective electronic switch circuitry, and a sealedsecond end at the second end of the selective electronic switchcircuitry. It also forms an elongated body that entirely surrounds theselective electronic switch circuitry and extends between the sealedfirst and second ends. This method 1000 helps to ensure that theselective electronic switch circuitry is immovable and sealed within thepressure-isolating enclosure of the pressure bulkhead structure, to helpto prevent inadvertent detonation or detonation interference of theselect fire sub assembly.

As can be seen from the disclosure, the pressure bulkhead structures andinner pressure-isolating enclosures require no moving parts (as inmechanical switches, or distinct fastenable retainer means) by the enduser. Further such structures and enclosures allow for the use of solidstate electronics in a variety of harsh environmental conditions thatwould normally be deleterious to such technology. For example, suchpressure bulkhead structures and inner pressure-isolating enclosuresprovide protection to normally sensitive circuitry at conditionsmeeting/exceeding both industry typical RDX and HMX explosivestime/temperature rating, such as temperatures exceeding 150° C., andmore specifically, temperatures exceeding 375° C., and under wellcompletion operations in which jarring, and/or physical movement arecommon. Furthermore, the pressure bulkhead structures and innerpressure-isolating enclosures provide for pin contacts (and pinassemblies) to be insulated from direct contact with a pressurebulkhead, while still allowing the pressure bulkhead to be electricallyconnected to the select fire sub assembly, the select fire sub assemblyretaining device and a common ground contact. The modular units may bemanufactured by a variety of methods, to create a seamless modular piececonstruction for use in multiple bulkhead designs, and which helpprotect the housed circuitry from unnecessary shocks, vibrations orother environmental conditions, which could negatively impact thefunctionality of electronic circuitry.

The components of the apparatus illustrated are not limited to thespecific embodiments described herein, but rather, features illustratedor described as part of one embodiment can be used on or in conjunctionwith other embodiments to yield yet a further embodiment. It is intendedthat the apparatus include such modifications and variations.

While the apparatus and methods have been described with reference tospecific embodiments, it will be understood by those skilled in the artthat various changes may be made and equivalents may be substituted forelements thereof without departing from the scope contemplated. Inaddition, many modifications may be made to adapt a particular situationor material to the teachings found herein without departing from theessential scope thereof.

In this specification and the claims that follow, reference will be madeto a number of terms that have the following meanings. The singularforms “a,” “an” and “the” include plural referents unless the contextclearly dictates otherwise. Furthermore, references to “one embodiment”,“some embodiments”, “an embodiment” and the like are not intended to beinterpreted as excluding the existence of additional embodiments thatalso incorporate the recited features. Approximating language, as usedherein throughout the specification and claims, may be applied to modifyany quantitative representation that could permissibly vary withoutresulting in a change in the basic function to which it is related.Accordingly, a value modified by a term such as “about” is not to belimited to the precise value specified. In some instances, theapproximating language may correspond to the precision of an instrumentfor measuring the value. Terms such as “first,” “second,” “upper,”“lower” etc. are used to identify one element from another, and unlessotherwise specified are not meant to refer to a particular order ornumber of elements.

As used herein, the terms “may” and “may be” indicate a possibility ofan occurrence within a set of circumstances; a possession of a specifiedproperty, characteristic or function; and/or qualify another verb byexpressing one or more of an ability, capability, or possibilityassociated with the qualified verb. Accordingly, usage of “may” and “maybe” indicates that a modified term is apparently appropriate, capable,or suitable for an indicated capacity, function, or usage, while takinginto account that in some circumstances the modified term may sometimesnot be appropriate, capable, or suitable. For example, in somecircumstances an event or capacity can be expected, while in othercircumstances the event or capacity cannot occur—this distinction iscaptured by the terms “may” and “may be.”

As used in the claims, the word “comprises” and its grammatical variantslogically also subtend and include phrases of varying and differingextent such as for example, but not limited thereto, “consistingessentially of” and “consisting of.” Where necessary, ranges have beensupplied, and those ranges are inclusive of all sub-ranges therebetween.It is to be expected that variations in these ranges will suggestthemselves to a practitioner having ordinary skill in the art and, wherenot already dedicated to the public, the appended claims should coverthose variations.

Advances in science and technology may make equivalents andsubstitutions possible that are not now contemplated by reason of theimprecision of language; these variations should be covered by theappended claims. The patentable scope thereof is defined by the claims,and may include other examples that occur to those of ordinary skill inthe art. Such other examples are intended to be within the scope of theclaims if they have structural elements that do not differ from theliteral language of the claims, or if they include equivalent structuralelements with insubstantial differences from the literal language of theclaims.

What is claimed is:
 1. A pressure bulkhead structure of a perforatinggun select fire sub assembly, the pressure bulkhead structurecomprising: a pressure-isolating enclosure comprising apressure-isolating enclosure body having a sealed first end, a sealedsecond end, and an elongated body portion, wherein the elongated bodyportion extends between the sealed first end and the sealed second endalong a longitudinal direction of the enclosure body; a selectiveelectronic switch circuitry positioned between the sealed first end andthe sealed second end of the pressure-isolating enclosure body; anelectrical connector extends from the selective electronic switchcircuitry through the sealed first end; a wiring arrangement extendsfrom the selective electronic switch circuitry through the sealed secondend; and a common ground contact extends from the selective electronicswitch circuitry through the sealed second end, wherein the selectiveelectronic switch circuitry is immovable and sealed within thepressure-isolating enclosure body.
 2. The pressure bulkhead structure ofclaim 1, wherein the electrical connector comprises one of a wire and apin contact.
 3. The pressure bulkhead structure of claim 1, wherein thepressure-isolating enclosure is formed by one of injection-molding,potting and 3D-printing, over the selective electronic switch circuitry,such that no manufacturing seams are present within thepressure-isolating enclosure body.
 4. The pressure bulkhead structure ofclaim 1, wherein the common ground contact comprises one of a groundwire and a plurality of ground arms.
 5. A pressure bulkhead structure ofa perforating gun select fire sub assembly, the pressure bulkheadstructure comprising: a pressure-isolating enclosure comprising apressure-isolating enclosure body having a sealed first end, a sealedsecond end, and an elongated body portion, wherein the elongated bodyportion extends between the sealed first end and the sealed second endalong a longitudinal direction of the enclosure body; a selectiveelectronic switch circuitry positioned between the sealed first end andthe sealed second end of the pressure-isolating enclosure body; anelectrical connector extends from the selective electronic switchcircuitry through the sealed first end; a wiring arrangement extendsfrom the selective electronic switch circuitry through the sealed secondend; and a plurality of ground arms extend from the selective electronicswitch circuitry through the sealed second end, wherein the selectiveelectronic switch circuitry is immovable and sealed within thepressure-isolating enclosure body.
 6. The pressure bulkhead structure ofclaim 5, wherein the plurality of ground arms comprises: a first groundarm; and a second ground arm, wherein the first and second ground armsare bilaterally spaced apart from each other, the wiring arrangementextends from the selective electronic switch circuitry between the firstground arm and the second ground arm, and the first and second groundarms are each integrally formed with the selective electronic switchcircuitry.
 7. The pressure bulkhead structure of claim 6, wherein: theselective electronic switch circuitry comprises an electronic circuitboard and electronic switch components affixed to at least one side ofthe electronic circuit board; and the ground arms are formed bystamping, cutting out, or wet chemically etching a centrally extendingsection of the electronic circuit board that is devoid of electronicswitch components.
 8. The pressure bulkhead structure of claim 6,wherein a contact pad extends from an end of each ground arm, and thecontact pad is configured for making electrical connections withcorresponding electrically conductive materials positioned outside ofthe pressure bulkhead structure.
 9. The pressure bulkhead structure ofclaim 8, wherein the contact pad is glued, snapped, screwed,frictionally affixed, clipped on, chemically vapor deposed or otherwisecoupled to each ground arm.
 10. The pressure bulkhead structure of claim5, wherein the electrical connector comprises one of a wire and a pincontact.
 11. The pressure bulkhead structure of claim 5, wherein theselective electronic switch circuitry is immune to RF frequencies,unwanted or stray direct and indirect voltage and current.
 12. Thepressure bulkhead structure of claim 5, wherein the pressure-isolatingenclosure body is formed about the selective electronic switch circuitrysuch that there are no spatial gaps between the pressure-isolatingenclosure body and the selective electronic switch circuitry.
 13. Thepressure bulkhead structure of claim 5, wherein the pressure-isolatingenclosure body is formed by one of injection-molding, potting and3D-printing, over the selective electronic switch circuitry, such thatno manufacturing seams are present within the pressure-isolatingenclosure body.
 14. The pressure bulkhead structure of claim 5, whereinthe pressure-isolating enclosure body further comprises: at least onecircumferential groove formed in an outer edge of the pressure-isolatingenclosure body; and an O-ring positioned in the at least onecircumferential groove.
 15. A pressure bulkhead structure for placementin a select fire sub assembly of a perforating gun module, wherein thepressure bulkhead structure forms a pressure isolating chamber betweensequential perforating gun modules, the pressure bulkhead structurecomprising: an outer pressure-isolating enclosure including a conductivematerial and having a first end and a second end, the first endsurrounding a down hole facing pin assembly, the outer pressureisolating enclosure having an outer wall edge and an inner wall edge,with the inner wall edge defining an interior cavity; an innerpressure-isolating enclosure, the inner pressure-isolating enclosurecomprising an inner pressure-isolating body having a sealed first endadjacent the down hole facing pin assembly, an elongated body portionhaving a longitudinal direction length, the elongated body portionextending between the first end and the second end, the innerpressure-isolating enclosure body further including an outer edge and aninner edge, wherein the outer edge is adjacent the inner wall edge ofthe outer pressure-isolating enclosure and the entirety of the innerpressure-isolating enclosure body is located within the interior cavity;a selective electronic switch circuitry positioned within the innerpressure-isolating enclosure body, the selective electronic switchcircuitry positioned inward from the sealed first and second ends of theinner pressure-isolating enclosure body, such that the selectiveelectronic switch circuitry is spaced apart from the sealed first andsecond ends; a pin contact attached to and extending from the selectiveelectronic switch circuitry, and partially extending through the sealedfirst end so as to make electrical contact with the down hole facing pinassembly located outside the inner pressure-isolating enclosure body; awiring arrangement attached to and extending from the selectiveelectronic switch circuitry, and partially extending through the sealedsecond end, so as to provide electrical communication connection betweenthe selective electronic switch circuitry and other components outsideof the inner pressure-isolating enclosure body; and a common groundcontact attached to and extending from the selective electronic switchcircuitry, and partially extending through the sealed second end so asto make electrical contact with conductive material of the outerpressure isolating enclosure, either directly or indirectly.
 16. Thepressure bulkhead structure of claim 15, wherein: the second end of theouter pressure-isolating enclosure surrounds a retainer; the sealedsecond end is adjacent the retainer; and the common ground furtherextending through the retainer.
 17. The pressure bulkhead structure ofclaim 15, wherein the sealed second end of the inner pressure-isolatingenclosure body is covered with a threaded retainer that holds the innerpressure-isolating enclosure body in place within the outerpressure-isolating enclosure, and the common ground contact iselectrically connected to the outer pressure-isolating enclosure via thethreaded retainer.
 18. The pressure bulkhead structure of claim 15,wherein the inner pressure-isolating enclosure body is injectionover-molded about the selective electronic switch circuitry, so that theinner pressure-isolating enclosure body includes no manufacturing seamswithin its structure.
 19. The pressure bulkhead structure of claim 15,wherein each of the outer pressure-isolating enclosure and the innerpressure-isolating enclosure body include pressure sealing mechanismsassociated with their respective outer edges for maintaining pressurewithin such pressure bulkhead structure and any associated perforatinggun select fire sub assembly which may include such pressure bulkheadstructure.
 20. The pressure bulkhead structure of claim 15, wherein thecommon ground contact comprises one of a ground wire and a plurality ofground arms.